SEMICON Japan returns to Tokyo Big Sight December 9–11, 2026, organized by SEMI, with exhibition hours listed from 10:00 to 17:00 and free exhibition entrance on the official overview. The useful planning question is not whether the industry will show up—it is how to sequence a free exhibition floor against concurrent packaging, design and metrology summits, then choose an Ariake, Toyosu or Ginza base that matches the meetings.
Who should cross for this
Semiconductor equipment, materials, packaging, design, metrology and manufacturing professionals, plus buyers, investors and policy teams working the Japan–Taiwan–North America supply chain.
Japan’s equipment and materials strengths meet Taiwan foundry and packaging ecosystems and North American fab and R&D investment. Pair a December Tokyo week with SEMICON Taiwan in late August–early September 2026 for a two-stop Asia semiconductor itinerary.
Suggested trip length: 4–5 days
Register early, then separate floor time from summit time
SEMICON Japan runs three full show days, December 9–11, 2026, with exhibition hours listed as 10:00–17:00. The official overview marks exhibition entrance as free, but a printed or digital visitor badge is still the practical gate—complete registration on the SEMI Japan site once the 2026 portal is clearly live, and print or store credentials as instructed. Concurrent APCS, ADIS and MIS programming can fill a calendar quickly; invitation-only networking and educational courses are not the same product as walking the exhibition. Build a morning floor block and an afternoon summit block rather than assuming one pass unlocks every room.
Choose a base for the meetings you actually have
Ariake is the shortest commute to Tokyo Big Sight and the simplest choice for early booth appointments. Toyosu keeps you on the Yurikamome with a wider dinner pool. Ginza works when the trip mixes Big Sight days with central Tokyo customer or investor meetings—but plan the Shimbashi transfer and leave buffer for packed trains. Book lodging as soon as travel dates firm; December fair weeks tighten Ariake inventory.
Use the concurrent summits—and the Taiwan week—as planning anchors
SEMI lists three concurrent summits with the 2026 show: Advanced Packaging and Chiplet Summit (APCS), Advanced Design Innovation Summit (ADIS) and Metrology & Inspection Summit (MIS). Treat those names as confirmed; treat speakers, room assignments and ticket rules as live-check items. For a broader Pacific year, SEMICON Taiwan’s International Semiconductor Week runs August 31–September 4, 2026 in Taipei (exhibition September 2–4). A North American team covering both stops can separate packaging/materials conversations in Tokyo from foundry and ecosystem meetings in Taipei without inventing a joint ticket.
Official information
Plan the rest of the trip
Sources
- SEMICON Japan official site ↗
- Advanced Packaging and Chiplet Summit (APCS) ↗
- Visitor registration and pricing ↗
- Tokyo Big Sight visitor access ↗
- JETRO SEMICON Japan 2025 event report ↗
- SEMICON Taiwan official site ↗
Last verified July 23, 2026. Event schedules, venues, and registration details can change; confirm with the organizer before booking travel.
